TY - JOUR
TI - Modeling of steady and transient temperature distribution in the device for measuring the thermal conductivity
AU - Duda, Piotr
AU - Duda, Roman
TI - Modeling of steady and transient temperature distribution in the device for measuring the thermal conductivity
AB - 
	The aim of this paper is the presentation of the method for thermal conductivity measurement and numerical modeling of temperature distribution in apparatus for measuring the thermal conductivity. Experimental studies will be carried out in transient state until the steady state heat conduction in apparatus is achieved. The calculated and measured temperature distribution will be compared. The time to steady state in apparatus for different samples will be estimated based on numerical and experimental results. The influence of the contact resistance between the sample and the measuring device will be analyzed.
VL - 2013
IS - Mechanics Issue 1-M (5) 2013
PY - 2014
SN - 0011-4561
C1 - 2353-737X
SP - 73
EP - 80
DO - 10.4467/2353737XCT.14.010.1936
UR - https://ejournals.eu/en/journal/czasopismo-techniczne/article/modeling-of-steady-and-transient-temperature-distribution-in-the-device-for-measuring-the-thermal-conductivity
KW - heat conduction
KW - CFD modeling